A Study of Factors Affecting to the Film Peeling Problem in Silicon Wafer Coating by Using Design of Experiment Technique

Abstract

This paper aims to study the effect of 3 factors (substrate temperature, the vacuum pressure, the evaporation rate of the coating) that effect the peeling of the thin films in the coated silicon wafer process in case study factory. The designing of 2³ full factorial experiments were used to study the rate of peeling of the film, with will test two samples for each experiment, a total of 32 samples, and the experiment were repeated two times. By testing the adhesion of the film with film surface is cut square. Then, using transparent adhesive tape around the cut and pull those to assess the rate of the peeling of thin films. The result showed that the main factor effecting the film peeling at significant 95% (α = 0.05) were the substrate temperature, the interaction between substrate temperature and vacuum pressure and the interaction of three main factors (substrate temperature, vacuum pressure, and the rate of evaporation)