Study on the Heat Transfer Characteristics of a Vapor Chamber without Micro-channel for Cooling an Electronic Component

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Songkran Wiriyasart Paisarn Naphon

Abstract

Numerical results on the thermal performance of vapor chamber without micro-channel for cooling computer processing unit (CPU) are presented. The vapor chamber is an advanced cooling heat spreader for cooling CPUs in personal computers and work stations. The results obtained from the model are compared with those from the measured data. The mathematical model of the vapor chamber in this study is a two-phase closed chamber with wick sheet and a wick column. By solving the equations of continuity, momentum, and energy numerically, the pressure and temperature distributions inside the vapor chamber are presented. In the experiment, the CPU is replaced by a heater as the heat source, with power input of 80 W. The experimental tests are carried out, and good agreement is obtained with the numerical results. These numerical results are useful for the design to improve thermal performance of the vapor chamber, and also diminished the expense and time of the real test.


Keywords: Vapor Chamber, Micro-Channel, Liquid cooling,
Computer Processing Unit;

Keywords

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How to Cite
Wiriyasart, S., & Naphon, P. (1). Study on the Heat Transfer Characteristics of a Vapor Chamber without Micro-channel for Cooling an Electronic Component. Science & Technology Asia, 18(3), 16-22. Retrieved from https://www.tci-thaijo.org/index.php/SciTechAsia/article/view/41137
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