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This research was purposed to reduce defects and improve process control for Electro-plating process in integrated circuits manufacturing. The major defects are excessive Tine plating, Tin plating thickness out of spec and Solderability failure respectively. This research applied fish bone diagram, process failure mode and effect analysis (PFMEA) and design of experiment (DOE) technique to find out the root cause of problem. Base on analysis results, the major causes of the problem are the contamination in chemical and improper parameters setting. The results after improvement showed that the defect rate of excessive Tin plating and Tin plating thickness out of spec were reduced from 46% to 5% LRR and 0.3% to 0.05% LRR respectively, and showed zero defects for Solderability failure. In addition, the process control such as SPC and visual-control was improved and can control the defect rate within acceptable limit continuously.